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1
Research on chemical mechanical polishing mechanism of novel diffusion barrier Ru for Cu interconnect
Foilsithe / Cruthaithe 2018Available for University of the Philippines System via SpringerLink. Click here to access
Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy
Electronic Resource -
2
Coagulation-flocculation of combined chemical mechanical polishing wastewater and flouride-containing wastewater from a semiconductor manufacturer
Foilsithe / Cruthaithe 2007Tráchtas


