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9Investigations on microstructure and mechanical properties of the Cu/Pb-free solder joint interfacesBằng Zhang, QingkeAvailable for University of the Philippines System via SpringerLink. Click here to access
Được phát hành 2016
Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy
Electronic Resource -
10Bằng Siddiqui, TariqAvailable for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
Được phát hành 2015
Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
Electronic Resource