Showing 1 - 10 results of 25 for search '', सवाल का समय: 0.02सेकंड परिणाम को परिष्कृत करें
  1. 1

    Investigations on microstructure and mechanical properties of the Cu/Pb-free solder joint interfaces द्वारा Zhang, Qingke

    प्रकाशित 2016
    Available for University of the Philippines System via SpringerLink. Click here to access
    Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy
    Electronic Resource

    Investigations on microstructure and mechanical properties of the Cu/Pb-free solder joint interfaces
  2. 2

    Fundamentals of lead-free solder interconnect technology from microstructures to reliability द्वारा Lee, Tae-Kyu, Bieler, Thomas R., Kim, Choong-Un, Ma, Hongtao

    प्रकाशित 2015
    Available for University of the Philippines System via SpringerLink. Click here to access
    Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy
    Electronic Resource

    Fundamentals of lead-free solder interconnect technology from microstructures to reliability
  3. 3

    Quality hand soldering and circuit board repair द्वारा Smith, H. Ted

    प्रकाशित 2013
    पुस्तक

    Quality hand soldering and circuit board repair
  4. 4

    The art of soldering for jewelry makers techniques and projects द्वारा Devenney, Wing Mun

    प्रकाशित 2013
    पुस्तक

    The art of soldering for jewelry makers techniques and projects
  5. 5

    Lead-free solder process development

    प्रकाशित 2011
    पुस्तक

    Lead-free solder process development
  6. 6

    The ELFNET book on failure mechanisms, testing methods, and quality issues of lead-free solder interconnects द्वारा Grossmann, Günter, Zardini, Christian

    प्रकाशित 2011
    Available for University of the Philippines Diliman via SpringerLink. Click here to access
    Electronic Resource

    The ELFNET book on failure mechanisms, testing methods, and quality issues of lead-free solder interconnects
  7. 7

    Thermal aging effects on intermetallic compound growth kinetics and solder joint reliability performance involving Sn-1.2%Ag-0.5%Cu with Ni Dopant on copper organic solderability (... द्वारा Manauis, Melissa B.

    प्रकाशित 2007
    थीसिस

    Thermal aging effects on intermetallic compound growth kinetics and solder joint reliability performance involving Sn-1.2%Ag-0.5%Cu with Ni Dopant on copper organic solderability (Cu OSP) substrate surface finish
  8. 8

    Soldering in electronics assembly द्वारा Judd, Mike, Brindley, Keith

    प्रकाशित 1999
    Available for University of the Philippines System via ScienceDirect. Click here to access
    Also available remotely for University of the Philippines System via ScienceDirect. Click here to access thru EZproxy
    Electronic Resource

    Soldering in electronics assembly
  9. 9

    Modern solder technology for competitive electronics manufacturing द्वारा Hwang, Jennie S.

    प्रकाशित 1996
    पुस्तक

    Modern solder technology for competitive electronics manufacturing
  10. 10

    The handbook of machine soldering SMT and TH. द्वारा Woodgate, Ralph W. 1922-

    प्रकाशित 1996
    पुस्तक

    The handbook of machine soldering SMT and TH.

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