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  1. 1

    Handbook of wafer bonding

    Wydane 2012
    Książka

    Handbook of wafer bonding
  2. 2

    Characterization of silicon p-n junctions fabricated by ion shower doping od Diaz, Jose Mario A.

    Wydane 2004
    Praca dyplomowa

    Characterization of silicon p-n junctions fabricated by ion shower doping
  3. 3

    Understanding the effect of surface flaws on fracture of silicon die od Punzalan, Jaime C.

    Wydane 2003
    Praca dyplomowa

    Understanding the effect of surface flaws on fracture of silicon die
  4. 4

    Handbook of semiconductor wafer cleaning technology science, technology, and applications

    Wydane 1993
    Książka

    Handbook of semiconductor wafer cleaning technology science, technology, and applications
  5. 5

    Warpage characterization for silicon-based integrated circuits od Montesa, Christine Marie C.

    Praca dyplomowa

    Warpage characterization for silicon-based integrated circuits
  6. 6

    Analysis of die tilt effect on silicon die crack propagation in a small outline transistor using computational fracture mechanics od Fabular, Jennifer J.

    Praca dyplomowa

    Analysis of die tilt effect on silicon die crack propagation in a small outline transistor using computational fracture mechanics

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