Introduction to system-on-package (SOP) miniaturization of the entire system Autor Tummala, Rao R. 1942-

Table of contents only

System-on-package (SOP) miniaturization of the entire system Autor Tummala, Rao R. 1942-

Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy

Multichip module technology handbook Autor Garrou, Philip E.

Flip chip technologies

Routing in the third dimension from VLSI chips to MCMs Autor Sherwani, Naveed A.

Introduction to multichip modules Autor Sherwani, N. A.

Physical design for multichip modules Autor Sriram, M. 1966-

Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability Autor Pecht, Michael

Microelectronic system interconnections performance and modeling

Electronics packaging forum multichip module technology issues