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  1. 1

    Fundamentals of device and systems packaging technologies and applications

    Publié 2019
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    Fundamentals of device and systems packaging technologies and applications
  2. 2

    MEMS packaging

    Publié 2018
    Available for University of the Philippines Diliman via World Scientific. Click here to access
    Also available remotely for University of the Philippines Diliman via World Scientific. Click here to access thru EZproxy
    Electronic Resource

    MEMS packaging
  3. 3

    RF and microwave microelectronics packaging II

    Publié 2017
    Available for University of the Philippines System via SpringerLink. Click here to access
    Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy
    Electronic Resource

    RF and microwave microelectronics packaging II
  4. 4

    3D IC integration and packaging par Lau, John H.

    Publié 2016
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    3D IC integration and packaging
  5. 5

    Advanced MEMS packaging

    Publié 2010
    Also available online for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Livre

    Advanced MEMS packaging
  6. 6

    Advanced MEMS packaging

    Publié 2010
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    Advanced MEMS packaging
  7. 7

    System-on-package (SOP) miniaturization of the entire system par Tummala, Rao R. 1942-

    Publié 2008
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    System-on-package (SOP) miniaturization of the entire system
  8. 8

    Introduction to system-on-package (SOP) miniaturization of the entire system par Tummala, Rao R. 1942-

    Publié 2008
    Table of contents only
    Livre

    Introduction to system-on-package (SOP) miniaturization of the entire system
  9. 9

    Quantum-well laser array packaging nanoscale packaging techniques

    Publié 2007
    Livre

    Quantum-well laser array packaging nanoscale packaging techniques
  10. 10

    Quantum-well laser array packaging nanoscale packaging techniques

    Publié 2007
    Available for University of the Philippines Diliman via McGraw-Hill eBook Library. Click here to access
    Electronic Resource

    Quantum-well laser array packaging nanoscale packaging techniques

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