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  1. 1

    Fundamentals of device and systems packaging technologies and applications

    Gepubliceerd in 2019
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    Fundamentals of device and systems packaging technologies and applications
  2. 2

    MEMS packaging

    Gepubliceerd in 2018
    Available for University of the Philippines Diliman via World Scientific. Click here to access
    Also available remotely for University of the Philippines Diliman via World Scientific. Click here to access thru EZproxy
    Electronic Resource

    MEMS packaging
  3. 3

    RF and microwave microelectronics packaging II

    Gepubliceerd in 2017
    Available for University of the Philippines System via SpringerLink. Click here to access
    Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy
    Electronic Resource

    RF and microwave microelectronics packaging II
  4. 4

    3D IC integration and packaging door Lau, John H.

    Gepubliceerd in 2016
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    3D IC integration and packaging
  5. 5

    Advanced MEMS packaging

    Gepubliceerd in 2010
    Also available online for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Boek

    Advanced MEMS packaging
  6. 6

    Advanced MEMS packaging

    Gepubliceerd in 2010
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    Advanced MEMS packaging
  7. 7

    System-on-package (SOP) miniaturization of the entire system door Tummala, Rao R. 1942-

    Gepubliceerd in 2008
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    System-on-package (SOP) miniaturization of the entire system
  8. 8

    Introduction to system-on-package (SOP) miniaturization of the entire system door Tummala, Rao R. 1942-

    Gepubliceerd in 2008
    Table of contents only
    Boek

    Introduction to system-on-package (SOP) miniaturization of the entire system
  9. 9

    Quantum-well laser array packaging nanoscale packaging techniques

    Gepubliceerd in 2007
    Boek

    Quantum-well laser array packaging nanoscale packaging techniques
  10. 10

    Quantum-well laser array packaging nanoscale packaging techniques

    Gepubliceerd in 2007
    Available for University of the Philippines Diliman via McGraw-Hill eBook Library. Click here to access
    Electronic Resource

    Quantum-well laser array packaging nanoscale packaging techniques

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