Arama Sonuçları
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Finite element analysis of the deformation behavior of a thin flexible substrate due to thermal loading
Baskı/Yayın Bilgisi 2006Tez -
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Characterization of integrated circuit packaging materials
Baskı/Yayın Bilgisi 1993Available for University of the Philippines System via ScienceDirect. Click here to access
Also available remotely for University of the Philippines System via ScienceDirect. Click here to access thru EZproxy
Electronic Resource -
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Fundamentals of modern VLSI devices
Baskı/Yayın Bilgisi 2021Click here to access thru EZproxy
Click here to access
Electronic Resource


