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Finite element analysis of the deformation behavior of a thin flexible substrate due to thermal loading
Veröffentlicht 2006Abschlussarbeit -
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Performance of a stacked p-i-n and high electron mobility (HEMT) layers on a single GaAs substate for optoelectronic integrated circuits
Veröffentlicht 2012Abschlussarbeit -
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Characterization of integrated circuit packaging materials
Veröffentlicht 1993Available for University of the Philippines System via ScienceDirect. Click here to access
Also available remotely for University of the Philippines System via ScienceDirect. Click here to access thru EZproxy
Electronic Resource -
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Fundamentals of modern VLSI devices
Veröffentlicht 2021Click here to access thru EZproxy
Click here to access
Electronic Resource


