Arama Sonuçları
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1
Characterization of integrated circuit packaging materials
Baskı/Yayın Bilgisi 1993Available for University of the Philippines System via ScienceDirect. Click here to access
Also available remotely for University of the Philippines System via ScienceDirect. Click here to access thru EZproxy
Electronic Resource -
2
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3
Polymeric materials for electronics packaging and interconnection
Baskı/Yayın Bilgisi 1989Available for University of the Philippines Diliman via ACS Publications. Click here to access
Also available remotely for University of the Philippines Diliman via ACS Publications. Click here to access thru EZproxy
Electronic Resource -
4
Quality conformance and qualification of microelectronic packages and interconnects
Baskı/Yayın Bilgisi 1994Kitap -
5
Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability
Baskı/Yayın Bilgisi 1994Kitap -
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9
Plastics for electronics materials, properties, and design applications
Baskı/Yayın Bilgisi 1995Kitap -
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