Canlyniadau Chwilio

Characterization of integrated circuit packaging materials

Available for University of the Philippines System via ScienceDirect. Click here to access
Also available remotely for University of the Philippines System via ScienceDirect. Click here to access thru EZproxy

Modern solder technology for competitive electronics manufacturing gan Hwang, Jennie S.

Polymeric materials for electronics packaging and interconnection

Available for University of the Philippines Diliman via ACS Publications. Click here to access
Also available remotely for University of the Philippines Diliman via ACS Publications. Click here to access thru EZproxy

Quality conformance and qualification of microelectronic packages and interconnects

Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability gan Pecht, Michael

Electronics packaging forum multichip module technology issues

Chip on board technologies for multichip modules

Materials for electronic packaging

Plastics for electronics materials, properties, and design applications gan Alvino, William M.

Physical architecture of VLSI systems