Resultados de búsqueda
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Characterization of integrated circuit packaging materials
Publicado 1993Available for University of the Philippines System via ScienceDirect. Click here to access
Also available remotely for University of the Philippines System via ScienceDirect. Click here to access thru EZproxy
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Polymeric materials for electronics packaging and interconnection
Publicado 1989Available for University of the Philippines Diliman via ACS Publications. Click here to access
Also available remotely for University of the Philippines Diliman via ACS Publications. Click here to access thru EZproxy
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Quality conformance and qualification of microelectronic packages and interconnects
Publicado 1994Libro -
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