অনুসন্ধান ফলাফলগুলি
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Characterization of integrated circuit packaging materials
প্রকাশিত 1993Available for University of the Philippines System via ScienceDirect. Click here to access
Also available remotely for University of the Philippines System via ScienceDirect. Click here to access thru EZproxy
Electronic Resource -
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Polymeric materials for electronics packaging and interconnection
প্রকাশিত 1989Available for University of the Philippines Diliman via ACS Publications. Click here to access
Also available remotely for University of the Philippines Diliman via ACS Publications. Click here to access thru EZproxy
Electronic Resource -
4
Quality conformance and qualification of microelectronic packages and interconnects
প্রকাশিত 1994গ্রন্থ -
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