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  1. 1

    Intermetallic phase formation and growth kinetics between Pb-free and eutectic Sn-Pb solder bumps on Cu-based under bump metallurgies by Borlasa, Ma. Eleanor Oyam

    Published 2004
    Thesis

    Intermetallic phase formation and growth kinetics between Pb-free and eutectic Sn-Pb solder bumps on Cu-based under bump metallurgies
  2. 2

    Development of a copper-tin shape memory alloy by Abellana, Virgilio Y.

    Published 2004
    Thesis

    Development of a copper-tin shape memory alloy

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