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61Investigations on microstructure and mechanical properties of the Cu/Pb-free solder joint interfacesBằng Zhang, QingkeAvailable for University of the Philippines System via SpringerLink. Click here to access
Được phát hành 2016
Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy
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63Bằng Peters, Benjamin 1980-Click here to access thru EZproxy
Được phát hành 2016
Click here to access
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69Bằng Gethmann, C. F., Carrier, M., Hanekamp, G., Kaiser, M., Kamp, G., Lingner, S., Quante, M., Thiele, F.Available for University of the Philippines System via SpringerLink. Click here to access
Được phát hành 2015
Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy
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70