Assembly and reliability of lead-free solder joints

Sonraí bibleagrafaíochta
Príomhchruthaitheoirí:	Lau, John H. (Údar), Lee, Ning-Cheng (Údar)
Údar corparáideach:	SpringerLink (Online service)
Formáid:	Electronic Resource
Teanga:	English
Foilsithe / Cruthaithe:	Singapore Springer [2020]
Ábhair:	Electronics. Microelectronics. Electronic circuits. Electronic books.
Rochtain ar líne:	Available for University of the Philippines Diliman via SpringerLink. Click here to access Also available remotely for University of the Philippines Diliman via SpringerLink. Click here to access thru EZproxy