APA (7th ed.) Citation

Lau, J. H., & Lee, N. (2020). Assembly and reliability of lead-free solder joints. Springer. https://doi.org/10.1007/978-981-15-3920-6

Chicago Style (17th ed.) Citation

Lau, John H., and Ning-Cheng Lee. Assembly and Reliability of Lead-free Solder Joints. Singapore: Springer, 2020. https://doi.org/10.1007/978-981-15-3920-6.

MLA (9th ed.) Citation

Lau, John H., and Ning-Cheng Lee. Assembly and Reliability of Lead-free Solder Joints. Springer, 2020. https://doi.org/10.1007/978-981-15-3920-6.