Journal of Electronic Packaging [ejournal].

Bibliographic Details
Corporate Author:	ASME
Format:	Continuing Resource
Language:	English
Published:	United States The American Society of Mechanical Engineering 1989-2022
Subjects:	Computer Science Applications. Electrical and Electronic Engineering. Electronic, Optical and Magnetic Materials. Mechanics of Materials.
Online Access:	Available for University of the Philippines Diliman via ASME. Click here to access