Journal of Electronic Packaging [ejournal].

Detalles Bibliográficos
Autor Corporativo:	ASME
Formato:	Continuing Resource
Lenguaje:	English
Publicado:	United States The American Society of Mechanical Engineering 1989-2022
Materias:	Computer Science Applications. Electrical and Electronic Engineering. Electronic, Optical and Magnetic Materials. Mechanics of Materials.
Acceso en línea:	Available for University of the Philippines Diliman via ASME. Click here to access