Encyclopedia of packaging materials, processes, and mechanics - Bar-Cohen, Avram 1946-; Suhling, J. C. (Jeffrey C.); Tay, Andrew A. O. (New Jersey World Scientific, 2019)
volume 1. Flip-chip and underfill materials and technology / editors, Pengli Zhu, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, P R China, Gang Li, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, P R China, C. P. Wong, Georgia Institute of Technology, USA -- volume 2. Wire bonding technology / editors, Dae Young Jung, State University of New York, Binghamton, USA, Stephen R. Cain, State University of New York, Binghamton, USA, William (Bill) T. Chen, Advanced Semiconductor Engineering, Inc. (ASE), Taiwan, Bahgat G. Sammakia, State University of New York, Binghamton, USA -- volume 3. Flexible chip I/O interconnects / editors, Muhannad S. Bakir, Georgia Institute of Technology, USA, Suresh K. Sitaraman, Georgia Institute of Technology, USA -- volume 4. Wafer bonding technology / Kuan-Neng Chen, National Chiao Tung University, Taiwan, Chuan Seng Tan, Nanyang Technological University, Singapore.
Includes bibliographical references and index.
Electronic reproduction.
Keywords: Packaging; Electronic books