Style de citation APA (7e éd.)

Huang, Y., Wan, X., & Yin, Z. (2019). Modeling and application of flexible electronics packaging (First edition.). Springer. https://doi.org/10.1007/978-981-13-3627-0

Style de citation Chicago (17e éd.)

Huang, YongAn, Xiaodong Wan, et Zhouping Yin. Modeling and Application of Flexible Electronics Packaging. First edition. Singapore: Springer, 2019. https://doi.org/10.1007/978-981-13-3627-0.

Style de citation MLA (9e éd.)

Huang, YongAn, et al. Modeling and Application of Flexible Electronics Packaging. First edition. Springer, 2019. https://doi.org/10.1007/978-981-13-3627-0.