Huang, Y., Wan, X., & Yin, Z. (2019). Modeling and application of flexible electronics packaging (First edition.). Springer. https://doi.org/10.1007/978-981-13-3627-0
शिकागो शैली (17वां संस्करण) प्रशस्ति पत्रHuang, YongAn, Xiaodong Wan, और Zhouping Yin. Modeling and Application of Flexible Electronics Packaging. First edition. Singapore: Springer, 2019. https://doi.org/10.1007/978-981-13-3627-0.
एमएलए (9वां संस्करण) प्रशस्ति पत्रHuang, YongAn, et al. Modeling and Application of Flexible Electronics Packaging. First edition. Springer, 2019. https://doi.org/10.1007/978-981-13-3627-0.
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