APA (7th ed.) Citation

Huang, Y., Wan, X., & Yin, Z. (2019). Modeling and application of flexible electronics packaging (First edition.). Springer. https://doi.org/10.1007/978-981-13-3627-0

Chicago Style (17th ed.) Citation

Huang, YongAn, Xiaodong Wan, and Zhouping Yin. Modeling and Application of Flexible Electronics Packaging. First edition. Singapore: Springer, 2019. https://doi.org/10.1007/978-981-13-3627-0.

MLA (9th ed.) Citation

Huang, YongAn, et al. Modeling and Application of Flexible Electronics Packaging. First edition. Springer, 2019. https://doi.org/10.1007/978-981-13-3627-0.