Fundamentals of device and systems packaging technologies and applications

Détails bibliographiques
Autres auteurs: Tummala, Rao R. 1942- (Éditeur intellectuel)
Format: Electronic Resource
Langue:English
Publié: New York McGraw-Hill Education [2019]
Édition:Second edition.
Sujets:
Accès en ligne:Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy