APA引文

Tummala, R. R. (2019). Fundamentals of device and systems packaging: Technologies and applications (Second edition.). McGraw-Hill Education.

芝加哥风格引文

Tummala, Rao R. Fundamentals of Device and Systems Packaging: Technologies and Applications. Second edition. New York: McGraw-Hill Education, 2019.

MLA引文

Tummala, Rao R. Fundamentals of Device and Systems Packaging: Technologies and Applications. Second edition. McGraw-Hill Education, 2019.

警告：这些引文格式不一定是100％准确.