Tummala, R. R. (2019). Fundamentals of device and systems packaging: Technologies and applications (Second edition.). McGraw-Hill Education.
शिकागो शैली (17वां संस्करण) प्रशस्ति पत्रTummala, Rao R. Fundamentals of Device and Systems Packaging: Technologies and Applications. Second edition. New York: McGraw-Hill Education, 2019.
एमएलए (9वां संस्करण) प्रशस्ति पत्रTummala, Rao R. Fundamentals of Device and Systems Packaging: Technologies and Applications. Second edition. McGraw-Hill Education, 2019.
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