Cita APA (7th ed.)

Tummala, R. R. (2019). Fundamentals of device and systems packaging: Technologies and applications (Second edition.). McGraw-Hill Education.

Cita Chicago (17th ed.)

Tummala, Rao R. Fundamentals of Device and Systems Packaging: Technologies and Applications. Second edition. New York: McGraw-Hill Education, 2019.

Cita MLA (9th ed.)

Tummala, Rao R. Fundamentals of Device and Systems Packaging: Technologies and Applications. Second edition. McGraw-Hill Education, 2019.