Ling, R. S. (2008). New tech, new ties: How mobile communication is reshaping social cohesion. MIT Press. https://doi.org/10.7551/mitpress/7568.001.0001
शिकागो शैली (17वां संस्करण) प्रशस्ति पत्रLing, Richard Seyler. New Tech, New Ties: How Mobile Communication Is Reshaping Social Cohesion. Cambridge, Massachusetts: MIT Press, 2008. https://doi.org/10.7551/mitpress/7568.001.0001.
एमएलए (9वां संस्करण) प्रशस्ति पत्रLing, Richard Seyler. New Tech, New Ties: How Mobile Communication Is Reshaping Social Cohesion. MIT Press, 2008. https://doi.org/10.7551/mitpress/7568.001.0001.
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