00000cab a22000003a 4500 UP-99796217613424591 Buklod 20231008002442.0 m |o d | cr cu|mmmmuaua 200704s xx d | ||r ||||| || DENGII rda eng Callanga, Jennifer author. Analysis of crack propagation under different die tilt configuration on a small outline transistor Jennifer Callanga [and three others]. pages 19-32 olor billustrations In today's microelectronic industry, the increasing demand for miniaturization and high function integration poses a big challenge in maintaining the reliability of the package. It was found out that majority of the reliability problems can be attributed to thermal and mechanical loadings during manufacturing and assembling process. Die cracking and die tilting are two of the most common defects originating from this process that affect the reliability of the electronic packages. This study aims to investigate the influence of die tilting to the propensity of crack propagation on the silicon die. In this research, the cooling phase of the die and clip attach reflow of small outline transistor was simulated using a finite element-based software. An initial crack was incorporated in the silicon die model to show the imperfections acquired during manufacturing stage. J-integral (J) parameter of fracture mechanics was employed as a criterion for the behavior of incipient cracks. With the assumption that the die used in this study exhibits linear elastic, isotropic property, the calculated J-integral values were correlated to the energy release rate (G). The simulation results showed that as the tilt angle increases, there is also a significant increase in the value of J-integral. The highest J value was observed on the maximum tilt angle. Moreover, this study presents clear relationship between the die strength and the specified failure factors; crack and tilt. Also available in print. Fracture mechanics. ANSYS. Crack propagation. Macaspac, Hannah Erika author. Danao, Louis Angelo author. Mena, Manolo author. Philippine Engineering Journal [eJournal] 41, 1 (2020). Available for University of the Philippines Diliman. Click here https://journals.upd.edu.ph/index.php/pej/article/view/7145 FI UP UPD DENG-II Article