APA (7. basım) Alıntı

Lau, J. H. (2018). Fan-out wafer-level packaging. Springer Singapore. https://doi.org/10.1007/978-981-10-8884-1

Chicago Style (17. basım) Atıf

Lau, John H. Fan-out Wafer-level Packaging. Singapore: Springer Singapore, 2018. https://doi.org/10.1007/978-981-10-8884-1.

MLA (9th ed.) Atıf

Lau, John H. Fan-out Wafer-level Packaging. Springer Singapore, 2018. https://doi.org/10.1007/978-981-10-8884-1.