APA (7th ed.) Citation

Lau, J. H. (2013). Through-silicon vias for 3D integration (First edition.). McGraw-Hill Education.

Chicago Style (17th ed.) Citation

Lau, John H. Through-silicon Vias for 3D Integration. First edition. New York: McGraw-Hill Education, 2013.

MLA (9th ed.) Citation

Lau, John H. Through-silicon Vias for 3D Integration. First edition. McGraw-Hill Education, 2013.