APA (7 वां संस्करण) प्रशस्ति पत्र

SpringerLink (Online service), Jawaid, M., & Swain, S. K. (2018). Bionanocomposites for packaging applications. Springer International Publishing AG.

शिकागो शैली (17वां संस्करण) प्रशस्ति पत्र

SpringerLink (Online service), Mohammad Jawaid, और Sarat Kumar Swain. Bionanocomposites for Packaging Applications. Cham: Springer International Publishing AG, 2018.

एमएलए (9वां संस्करण) प्रशस्ति पत्र

SpringerLink (Online service), et al. Bionanocomposites for Packaging Applications. Springer International Publishing AG, 2018.