Style de citation APA (7e éd.)

Lau, J. H. (2016). 3D IC integration and packaging (First edition.). McGraw-Hill Education.

Style de citation Chicago (17e éd.)

Lau, John H. 3D IC Integration and Packaging. First edition. New York: McGraw-Hill Education, 2016.

Style de citation MLA (9e éd.)

Lau, John H. 3D IC Integration and Packaging. First edition. McGraw-Hill Education, 2016.