APA-Zitierstil (7. Ausg.)

Lau, J. H. (2016). 3D IC integration and packaging (First edition.). McGraw-Hill Education.

Chicago-Zitierstil (17. Ausg.)

Lau, John H. 3D IC Integration and Packaging. First edition. New York: McGraw-Hill Education, 2016.

MLA-Zitierstil (9. Ausg.)

Lau, John H. 3D IC Integration and Packaging. First edition. McGraw-Hill Education, 2016.