3D microelectronic packaging from fundamentals to applications
| Körperschaft: | |
|---|---|
| Weitere Verfasser: | , |
| Format: | Electronic Resource |
| Sprache: | English |
| Veröffentlicht: |
Cham
Springer
[2017]
|
| Schlagworte: | |
| Online Zugang: | Available for University of the Philippines System via SpringerLink. Click here to access Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy |