Παραπομπή σε μορφή APA (7η εκδ.)

SpringerLink (Online service), Li, Y., & Goyal, D. (2017). 3D microelectronic packaging: From fundamentals to applications. Springer. https://doi.org/10.1007/978-3-319-44586-1

Παραπομπή σε μορφή Chicago (17η εκδ.)

SpringerLink (Online service), Yan Li, και Deepak Goyal. 3D Microelectronic Packaging: From Fundamentals to Applications. Cham: Springer, 2017. https://doi.org/10.1007/978-3-319-44586-1.

Παραπομπή σε μορφή MLA (9th εκδ.)

SpringerLink (Online service), et al. 3D Microelectronic Packaging: From Fundamentals to Applications. Springer, 2017. https://doi.org/10.1007/978-3-319-44586-1.