SpringerLink (Online service), Lu, D., & Wong, C. P. (2017). Materials for advanced packaging (Second edition.). Springer. https://doi.org/10.1007/978-3-319-45098-8
Style de citation Chicago (17e éd.)SpringerLink (Online service), Daniel Lu, et C. P. Wong. Materials for Advanced Packaging. Second edition. Cham: Springer, 2017. https://doi.org/10.1007/978-3-319-45098-8.
Style de citation MLA (9e éd.)SpringerLink (Online service), et al. Materials for Advanced Packaging. Second edition. Springer, 2017. https://doi.org/10.1007/978-3-319-45098-8.
Attention : ces citations peuvent ne pas être correctes à 100%.