SpringerLink (Online service), Lu, D., & Wong, C. P. (2017). Materials for advanced packaging (Second edition.). Springer. https://doi.org/10.1007/978-3-319-45098-8
Dyfyniad Arddull ChicagoSpringerLink (Online service), Daniel Lu, and C. P. Wong. Materials for Advanced Packaging. Second edition. Cham: Springer, 2017. https://doi.org/10.1007/978-3-319-45098-8.
Dyfyniad MLASpringerLink (Online service), et al. Materials for Advanced Packaging. Second edition. Springer, 2017. https://doi.org/10.1007/978-3-319-45098-8.
Rhybudd: Mae'n bosib nad yw'r dyfyniadau hyn bob amser yn 100% cywir.