Cita APA (7th ed.)

Wang, R., & Chakrabarty, K. (2017). Testing of interposer-based 2.5D integrated circuits. Springer. https://doi.org/10.1007/978-3-319-54714-5

Cita Chicago (17th ed.)

Wang, Ran, i Krishnendu Chakrabarty. Testing of Interposer-based 2.5D Integrated Circuits. Cham: Springer, 2017. https://doi.org/10.1007/978-3-319-54714-5.

Cita MLA (9th ed.)

Wang, Ran, i Krishnendu Chakrabarty. Testing of Interposer-based 2.5D Integrated Circuits. Springer, 2017. https://doi.org/10.1007/978-3-319-54714-5.