Wang, R., & Chakrabarty, K. (2017). Testing of interposer-based 2.5D integrated circuits. Springer. https://doi.org/10.1007/978-3-319-54714-5
Cita Chicago (17th ed.)Wang, Ran, i Krishnendu Chakrabarty. Testing of Interposer-based 2.5D Integrated Circuits. Cham: Springer, 2017. https://doi.org/10.1007/978-3-319-54714-5.
Cita MLA (9th ed.)Wang, Ran, i Krishnendu Chakrabarty. Testing of Interposer-based 2.5D Integrated Circuits. Springer, 2017. https://doi.org/10.1007/978-3-319-54714-5.
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