RF and microwave microelectronics packaging II

Bibliographische Detailangaben
Körperschaft:	SpringerLink (Online service)
Weitere Verfasser:	Kuang, Ken (HerausgeberIn), Sturdivant, Rick (HerausgeberIn)
Format:	Electronic Resource
Sprache:	English
Veröffentlicht:	Cham Springer [2017]
Schlagworte:	Microelectronic packaging. Electronic books.
Online Zugang:	Available for University of the Philippines System via SpringerLink. Click here to access Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy