Cita APA (7th ed.)

SpringerLink (Online service), Kuang, K., & Sturdivant, R. (2017). RF and microwave microelectronics packaging II. Springer. https://doi.org/10.1007/978-3-319-51697-4

Cita Chicago (17th ed.)

SpringerLink (Online service), Ken Kuang, i Rick Sturdivant. RF and Microwave Microelectronics Packaging II. Cham: Springer, 2017. https://doi.org/10.1007/978-3-319-51697-4.

Cita MLA (9th ed.)

SpringerLink (Online service), et al. RF and Microwave Microelectronics Packaging II. Springer, 2017. https://doi.org/10.1007/978-3-319-51697-4.