Cita APA (7th ed.)

Quimada, N. E., De Luna, M. D. G., & Lu, M. Treatment of printed circuit board wastewater containing copper and nickel ions by fluidized-bed homogeneous granulation process.

Cita Chicago (17th ed.)

Quimada, Nathaniel E., Mark Daniel G. De Luna, i Ming-Chun Lu. Treatment of Printed Circuit Board Wastewater Containing Copper and Nickel Ions by Fluidized-bed Homogeneous Granulation Process.

Cita MLA (9th ed.)

Quimada, Nathaniel E., et al. Treatment of Printed Circuit Board Wastewater Containing Copper and Nickel Ions by Fluidized-bed Homogeneous Granulation Process.