APA (7th ed.) Citation

Quimada, N. E., De Luna, M. D. G., & Lu, M. Treatment of printed circuit board wastewater containing copper and nickel ions by fluidized-bed homogeneous granulation process.

Chicago Style (17th ed.) Citation

Quimada, Nathaniel E., Mark Daniel G. De Luna, and Ming-Chun Lu. Treatment of Printed Circuit Board Wastewater Containing Copper and Nickel Ions by Fluidized-bed Homogeneous Granulation Process.

MLA (9th ed.) Citation

Quimada, Nathaniel E., et al. Treatment of Printed Circuit Board Wastewater Containing Copper and Nickel Ions by Fluidized-bed Homogeneous Granulation Process.

Warning: These citations may not always be 100% accurate.