Thermal stability study on Titanium disilicide (TISI2) thin films with titanium nitride (TIN) capping using atomic force microscopy
Titanium disilicide (TiSI2) has largely been used as gates and interconnects in semiconductor devices due to its low resistivity and good thermal stability. This work aimed to study the thermal stability of titanium disilicide thin film capped with titanium nitride based on measurements using the at...
| Publicado no: | Philippine Engineering Journal 23, 2 (2002). |
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| Formato: | Artigo |
| Idioma: | English |
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| Acesso em linha: | Also available online for University of the Philippines Diliman. Click here |