Thermal stability study on Titanium disilicide (TISI2) thin films with titanium nitride (TIN) capping using atomic force microscopy

Thermal stability study on Titanium disilicide (TISI2) thin films with titanium nitride (TIN) capping using atomic force microscopy

Veure totes les versions (2)

Titanium disilicide (TiSI2) has largely been used as gates and interconnects in semiconductor devices due to its low resistivity and good thermal stability. This work aimed to study the thermal stability of titanium disilicide thin film capped with titanium nitride based on measurements using the at...

Descripció completa

Dades bibliogràfiques
Publicat a:Philippine Engineering Journal 23, 2 (2002).
Autor principal: Venezuela, Jeffrey D.G
Altres autors: Amorsolo, Amorsolo V. Jr
Format: Article
Idioma:English
Matèries:
Thin films > Testing.
Titanium disilicide.
Accés en línia:Also available online for University of the Philippines Diliman. Click here