Silicon analog components device design, process integration, characterization, and reliability
| Główni autorzy: | , |
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| Korporacja: | |
| Resource Type: | Electronic Resource |
| Język: | English |
| Wydane: |
New York, NY
Springer New York
[2015]
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| Hasła przedmiotowe: | |
| Dostęp online: | Available for University of the Philippines System via SpringerLink. Click here to access Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy |
Internet
Available for University of the Philippines System via SpringerLink. Click here to accessAlso available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy
College of Engineering Library II (UP Diliman)
| Accession # | Call # | Volume/Part# | Copy # | Collection | Circulation Type | Circulation Status |
|---|---|---|---|---|---|---|
| UPDE-3260EB | Non-Circulation | Not Applicable |