Investigation of the effect of varying silicon die size and thickness on a small outline transistor on the silicon die crack using finite element method
The current trend for electronic products, especially those in the telecommunications, is to be more compact. To match the demand for compact products, a size reduction of electronic product components such as the small outline diodes (SOD) and small outline transistor (SOT) is therefore needed. Thi...
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| Format: | Thesis |
| Idioma: | English |
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