Cita APA (7th ed.)

Ducusin, H. E. R., Dimagiba, R. R. N., & Mena, M. G. Investigation of the effect of varying silicon die size and thickness on a small outline transistor on the silicon die crack using finite element method.

Cita Chicago (17th ed.)

Ducusin, Hannah Erika R., Richard Raymond N. Dimagiba, i Manolo G. Mena. Investigation of the Effect of Varying Silicon Die Size and Thickness on a Small Outline Transistor on the Silicon Die Crack Using Finite Element Method.

Cita MLA (9th ed.)

Ducusin, Hannah Erika R., et al. Investigation of the Effect of Varying Silicon Die Size and Thickness on a Small Outline Transistor on the Silicon Die Crack Using Finite Element Method.