00000cmm a22000004i 4500 UP-99796217611983846 Buklod 20230215105418.0 m |o d | ta 150323t20152015flu o u eng d 9781466589421 (e-book : PDF) (iLib)UPD-00254212164 FlBoTFG DENGII rda eng TK 7874.893 D47 2014eb Design of 3D integrated circuits and systems edited by Rohit Sharma, Krzysztof Iniewski ; foreword by Sung Kyu Lim. Boca Raton CRC Press [2015] 1 online resource text file, PDF. text rdacontent computer rdamedia online resource rdacarrier Includes bibliographical references and index. 1. 3D integration technology with TSV and IMC bonding / Katsuyuki Sakuma -- 2. Wafer-level three-dimensional ICs for advanced CMOS integration / Ronald J. Gutmann and Jian-Qiang Lu -- 3. Integration of graphics processing cores with microprocessors / Deepak C. Sekar and Chinnakrishnan Ballapuram -- 4. Electrothermal simulation of three-dimensional integrated circuits / Shivam Priyadarshi, Jianchen Hu, Michael B. Steer, Paul D. Franzon, and W. Rhett Davis -- 5. Thermal management in 3D ICs/systems / Francesco Zanini -- 6. Emerging interconnect technologies for 3D networks-on-chip / Rohit Sharma and Kiyoung Choi -- 7. Inductive-coupling thruchip interface for 3D integration / Noriyuki Miura and Tadahiro Kuroda -- 8. Fabrication and modeling of copper and carbon nanotube-based through-silicon via / Brajesh Kumar Kaushik, Manoj Kumar Majumder, and Archana Kumari -- 9. Low-power testing for 2D/3D devices and systems / Xijiang Lin, Xiaoqing Wen, and Dong Xiang. IP based subscription, on campus and remote access. Access via Electronic Resources of the UPD Engineering Library and University Library websites. Three-dimensional integrated circuits. Electronic books. Sharma, Rohit editor. Iniewski, Krzysztof editor. Electronic Resource http://www.crcnetbase.com/isbn/9781466589421 Available for University of the Philippines Diliman College of Engineering via CRCnetBASE. Click here to access https://www-taylorfrancis-com.ezproxy.engglib.upd.edu.ph/books/9781315215709 Also available remotely for University of the Philippines Diliman College of Engineering via CRCnetBASE. Click here to access thru EZproxy (viewed 01 February 2019) FO UPD DENG-II Electronic Resource