Elimination of assembly induced package cracks in plastic SOIC

Elimination of assembly induced package cracks in plastic SOIC

Considerable amount of information and knowledge is available on moisture induced package cracking, especially on surface mount devices. During IC assembly itself, plastic packages are subject to thermal and mechanical stresses which may lead to package cracking or degrade package strength, thus mak...

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Podrobná bibliografie
Vydáno v:Philippine Engineering Journal 18, 1 (1997(Je)).
Hlavní autor: De Guzman, Jose Cesar
Další autoři: Mena, Manolo G., Epistola, E.
Médium: Článek
Jazyk:English
Témata:
Plastic integrated circuit packaging.
Small-outline integrated circuit (SOIC).
Surface mount technology.
On-line přístup:Also available online for University of the Philippines Diliman. Click here