Elimination of assembly induced package cracks in plastic SOIC

Considerable amount of information and knowledge is available on moisture induced package cracking, especially on surface mount devices. During IC assembly itself, plastic packages are subject to thermal and mechanical stresses which may lead to package cracking or degrade package strength, thus mak...

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التفاصيل البيبلوغرافية

الحاوية / القاعدة:	Philippine Engineering Journal 18, 1 (1997(Je)).
المؤلف الرئيسي:	De Guzman, Jose Cesar
مؤلفون آخرون:	Mena, Manolo G., Epistola, E.
التنسيق:	مقال
اللغة:	English
الموضوعات:	Plastic integrated circuit packaging. Small-outline integrated circuit (SOIC). Surface mount technology.
الوصول للمادة أونلاين:	Also available online for University of the Philippines Diliman. Click here