Elimination of assembly induced package cracks in plastic SOIC

Considerable amount of information and knowledge is available on moisture induced package cracking, especially on surface mount devices. During IC assembly itself, plastic packages are subject to thermal and mechanical stresses which may lead to package cracking or degrade package strength, thus mak...

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发表在:	Philippine Engineering Journal 18, 1 (1997(Je)).
主要作者:	De Guzman, Jose Cesar
其他作者:	Mena, Manolo G., Epistola, E.
格式:	文件
语言:	English
主题:	Plastic integrated circuit packaging. Small-outline integrated circuit (SOIC). Surface mount technology.
在线阅读:	Also available online for University of the Philippines Diliman. Click here