Elimination of assembly induced package cracks in plastic SOIC

Considerable amount of information and knowledge is available on moisture induced package cracking, especially on surface mount devices. During IC assembly itself, plastic packages are subject to thermal and mechanical stresses which may lead to package cracking or degrade package strength, thus mak...

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Xuất bản năm:	Philippine Engineering Journal 18, 1 (1997(Je)).
Tác giả chính:	De Guzman, Jose Cesar
Tác giả khác:	Mena, Manolo G., Epistola, E.
Định dạng:	Bài viết
Ngôn ngữ:	English
Những chủ đề:	Plastic integrated circuit packaging. Small-outline integrated circuit (SOIC). Surface mount technology.
Truy cập trực tuyến:	Also available online for University of the Philippines Diliman. Click here