Elimination of assembly induced package cracks in plastic SOIC

Considerable amount of information and knowledge is available on moisture induced package cracking, especially on surface mount devices. During IC assembly itself, plastic packages are subject to thermal and mechanical stresses which may lead to package cracking or degrade package strength, thus mak...

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הוצא לאור ב:	Philippine Engineering Journal 18, 1 (1997(Je)).
מחבר ראשי:	De Guzman, Jose Cesar
מחברים אחרים:	Mena, Manolo G., Epistola, E.
פורמט:	Article
שפה:	English
נושאים:	Plastic integrated circuit packaging. Small-outline integrated circuit (SOIC). Surface mount technology.
גישה מקוונת:	Also available online for University of the Philippines Diliman. Click here