Elimination of assembly induced package cracks in plastic SOIC

Considerable amount of information and knowledge is available on moisture induced package cracking, especially on surface mount devices. During IC assembly itself, plastic packages are subject to thermal and mechanical stresses which may lead to package cracking or degrade package strength, thus mak...

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Détails bibliographiques

Publié dans:	Philippine Engineering Journal 18, 1 (1997(Je)).
Auteur principal:	De Guzman, Jose Cesar
Autres auteurs:	Mena, Manolo G., Epistola, E.
Format:	Article
Langue:	English
Sujets:	Plastic integrated circuit packaging. Small-outline integrated circuit (SOIC). Surface mount technology.
Accès en ligne:	Also available online for University of the Philippines Diliman. Click here