Elimination of assembly induced package cracks in plastic SOIC

Considerable amount of information and knowledge is available on moisture induced package cracking, especially on surface mount devices. During IC assembly itself, plastic packages are subject to thermal and mechanical stresses which may lead to package cracking or degrade package strength, thus mak...

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Τόπος έκδοσης:	Philippine Engineering Journal 18, 1 (1997(Je)).
Κύριος συγγραφέας:	De Guzman, Jose Cesar
Άλλοι συγγραφείς:	Mena, Manolo G., Epistola, E.
Μορφή:	Άρθρο
Γλώσσα:	English
Θέματα:	Plastic integrated circuit packaging. Small-outline integrated circuit (SOIC). Surface mount technology.
Διαθέσιμο Online:	Also available online for University of the Philippines Diliman. Click here