Elimination of assembly induced package cracks in plastic SOIC

Considerable amount of information and knowledge is available on moisture induced package cracking, especially on surface mount devices. During IC assembly itself, plastic packages are subject to thermal and mechanical stresses which may lead to package cracking or degrade package strength, thus mak...

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Bibliografiske detaljer

Udgivet i:	Philippine Engineering Journal 18, 1 (1997(Je)).
Hovedforfatter:	De Guzman, Jose Cesar
Andre forfattere:	Mena, Manolo G., Epistola, E.
Format:	Article
Sprog:	English
Fag:	Plastic integrated circuit packaging. Small-outline integrated circuit (SOIC). Surface mount technology.
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