00000cmm a22000004a 4500 UP-99796217611212105 Buklod 20241011135655.0 m go j cr cn |||aaaaa 241011s2011 xxk go||j| ||||||engdd 9780857292360 (eBook) 0857292366 (eBook) (iLib)UPD-00214608267 CSt DMLR rda eng DMLUC TS 610 E44 2011eb The ELFNET book on failure mechanisms, testing methods, and quality issues of lead-free solder interconnects by Günter Grossmann, Christian Zardini, editors. London New York Springer 2011. 1 online resource (viii, 313 pages) illustrations text rdacontent computer rdamedia online resource rdacarrier Includes bibliographical references 1. Deformation and Fatigue of Solders -- 2. Factors Affecting the Bulk Embrittlement of Pb-Free Solder Joints -- 3. Thermal Fatigue Analysis -- 4. Electrochemical Behavior of Solder Alloys -- 5. Void Formation by Kirkendall Effect in Solder Joints -- 6. Tin Whiskers -- 7. Electromigration in Solder Interconnects -- 8. Impact of Black Pad and Intermetallic Layers on the Risk for Fractures in Solder Joints to Electroless Nickel/Immersion Gold -- 9. Reliability of Electronic Assemblies under Mechanical Shock Loading -- 10. Impact of Humidity and Contamination on Surface Insulation Resistance and Electrochemical Migration -- 11. Lead Free and Other Process Effects on Conductive Anodic Filamentation (CAF) Resistance of Glass Reinforced Epoxy Laminates -- 12. PCB Delamination -- 13. Excessive Warpage of Large Packages during Reflow Soldering -- 14. Popcorn Cracking -- 15. Thermal Capability of Components. IP-based subscription, access limited to within on campus computer network Access via Electronic Resources of the UPD University Library Website The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is the work of the European network ELFNET which was founded by the European Commission in the 6th Framework Programme. It brings together contributions from the leading European experts in lead-free soldering. The limited validity of testing methods originating from tin-lead solder was a major point of concern in ELFNET members' discussions. As a result, the network's reliability group decided to bring together the material properties of lead-free solders, as well as the basics of material science, and to discuss their influence on the procedures for accelerated testing. This has led to a matrix of failure mechanisms and their activation and, as a result, to a comprehensive coverage of the scientific background and its applications in reliability testing of lead-free solder joints. The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is written for scientists, engineers and researchers involved with lead-free electronics Electronic reproduction. New York SpringerLink 2011. Available via World Wide Web through SpringerLink. Solder and soldering Fatigue. Fracture mechanics. Grossmann, Günter author. Zardini, Christian author. SpringerLink (Online service). http://link.springer.com/book/10.1007/978-0-85729-236-0 Available for University of the Philippines Diliman via SpringerLink. Click here to access FO UPD DMLR Electronic Resource