Ultra-thin chip technology and applications - Burghartz, Joachim N.; SpringerLink (Online service). (New York Springer, 2011)
Part I: From Thick Wafers to Ultra-Thin Silicon Chips -- Chapter 1: Why Are Silicon Wafers as Thick as They Are? -- Chapter 2: Thin Chips on the ITRS Roadmap -- Part II: Thin Chip Fabrication Technologies -- Chapter 3: Thin Wafer Manufacturing and Handling Using Low Cost Carriers -- Chapter 4: Ultra-thin Wafer Fabrication Through Dicing-by-Thinning -- Chapter 5: Thin Wafer Handling and Processing without Carrier Substrates -- Chapter 6: Epitaxial Growth and Selective Etching Techniques -- Chapter 7: Silicon-on-Insulator (SOI) Wafer-Based Thin-Chip Fabrication
Electronic reproduction.
Keywords: Integrated circuits -- Wafer-scale integration; Integrated circuits -- Wafer-scale integration -- Design and construction; Electronic books