Maximizing die shear strength in semiconductor manufacturing through design of experiments.
High efficiency, high speed and high quality objectives or semiconductor manufacturing require the strict control of thousands of process variables. In the die attach operation, die shear strength is inferred to be dependent on the bonding agent and the method employed in applying it. This paper det...
| הוצא לאור ב: | Philippine Industrial Engineering Journal 1, 1 (2 copies) (2004 (Feb)). |
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| פורמט: | Article |
| שפה: | English |
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