System-on-package (SOP) miniaturization of the entire system

System-on-package (SOP) miniaturization of the entire system

Библиографические подробности
Главный автор: Tummala, Rao R. 1942-
Другие авторы: Swaminathan, Madhavan
Формат: Electronic Resource
Язык:English
Опубликовано: New York McGraw-Hill c2008.
Редактирование:First edition.
Предметы:
Multichip modules (Microelectronics) > Design and construction.
Microelectronic packaging.
Electronic books.
Online-ссылка:Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy